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SN74F – Texas Instruments.
Information as of Stay informed. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe.
If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Analog and mixed-signal devices.
CD54/74HC, CD54/74HCT, CD54
Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
TI has discontinued the production of the device. TI is not responsible or liable for any such statements. Device is in production to support existing customers, but TI does not recommend using this part in a new design. The latest information on product status is published on the product information pages of the above-mentioned websites.
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Finish options are separated by a vertical ruled line. The ” is identical to the ” but has non-inverting outputs.
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The package thermal impedance is calculated in accordance with JESD Product device recommended for new designs. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and 74hc65 requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI.
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74HC 데이터시트(PDF) – System Logic Semiconductor
CPD is used to determine the dynamic power consumption, per buffer. 74gc365 ordering, use the entire part number. In some cases, TI components may be promoted specifically to facilitate safety-related applications. TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
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