IPC 9703 PDF

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View shipping rates and policies Average Customer Review: Of particular concern is the impact of lead-free solder on the reliability of PCBA interconnects. To further complicate matters, a single component may be subjected 973 many distinct system environments, leading to kpc about component qualification testing. This standardization effort has allowed the creation of a central database of SGT results with the long-term goal of developing better test fixture, PCB layout and process setup methods and guidelines.

This is critical during the early stages of the transition, a time when the industry has limited data on the effects of new elements introduced in the PCB, components and solder joints. However, before the industry can fully realize the benefits of SGT, there are more hurdles that should be overcome.

AmazonGlobal Ship Orders Internationally. Withoutabox Submit to Film Festivals. In practice, customer or component suppliers typically define strain limits. As we approach the July lead-free deadline, the transition to lead-free processes continues to cause anxiety. There also is a growing realization that fractures do not occur strictly on the manufacturing line.

Process steps with excessive strain are identified for optimization. Another benefit of SGT standardization is that it helps baseline typical strain readings observed during each assembly step. This ranges from multiple high-acceleration shocks experienced by handheld devices to shipping-shock impulses on expensive enterprise infrastructure equipment.


This also reduces downtime due to electrical and functional test failures. Discover Prime Book Box for Kids. Unfortunately, variations jpc methodology inhibit reliable data collection and prevent data comparison. Some capacitor vendors specify allowable strain limits.

It is hoped that this will spark a paradigm shift in the way ICT-fixture suppliers validate products. In addition to isolating potentially problematic operations, SGT validates that processes are operating within allowable strain levels. For many vendors, cost is an important factor when implementing routine SGT on their fixtures.

Strain Gage Testing: Standardization

It is clear that more research is required before the industry can agree on a common approach to strain limits. Many manufacturers may find flexure to be a problem as they ramp up to full lead-free production.

There is a critical need for this test method, as designing test conditions that can replicate these varied environments is becoming increasingly difficult. Aside from manufacturing characterization, SGT also can be used as a mechanical design-validation tool.

IPC Mechanical shock test for solder joint reliability – Scanditron

Manufacturers also have been aggressively developing SGT capability and consistent processes for use across their factories. This information will enable companies to execute SGT in a standardized and consistent manner. Get to Know Ip. Alexa Actionable Analytics for the Web.

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Strain Gage Testing: Standardization

Write a customer review. This is why many manufacturers are required to operate under strain levels specified by their customers or component suppliers. The document sets forth methodologies for determining the usage environment at the system level – designing representative board and component-level tests that can be used to judge robustness for the application.

Board-flexure control using strain gage measurement has become an effective method for preventing these failures. As awareness increases, it becomes obvious that SGT is a necessary tool for test-fixture vendors. Concerns about second-level interconnect SLI failures due to excessive flexure during board- and system-level assembly and test operations increase with the use of finer-pitch BGA components, thinner PCBs and lead-free interconnects Figure 1. Stacked rosette strain gage with pre-attached wires.

The primary issue is the increased stiffness of the lead-free solder alloys, which prevents the outer rows of solder balls from distributing as much stress to adjacent rows.

The document also provides reference strain limits. In addition to BGA components, SGT also is an invaluable tool for analyzing failures on other discrete surface mount devices, such as capacitors and resistors. Share your thoughts with other customers.

With the insight that this data provides, companies are better positioned to design and manufacture more mechanically reliable products.

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